Manufacturer No:04EM04-N3GM627-GA06U
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 4GB+4Gb221 ball FBGA
RFQ
CLOSE
Product Attribute | Attribute Value |
---|---|
Manufacturer: | Kingston |
Product Category: | Multichip Packages |
RoHS: | Details |
Memory Size: | 4 GB 4 Gbit |
Package / Case: | FBGA-221 |
Mounting Style: | SMD/SMT |
Minimum Operating Temperature: | - 25 C |
Maximum Operating Temperature: | + 85 C |
Brand: | Kingston |
Interface Type: | eMMC 5.0 |
Moisture Sensitive: | Yes |
Packaging: | Tray |
Product Type: | Multichip Packages |
other: | 152 |
Subcategory: | Memory & Data Storage |
Unit Weight: | 0.011393 oz |
W71NW20GD3DW
Brand:Winbond
MT30AZZZCD90TKXM-031 W.20T
Brand:Micron
W25M02GVZEIGS
Brand:Winbond
S71KS512SC0BHV000
Brand:Infineon Technologies
W71NW11GF1EW
Brand:Winbond
MT29C4G48MAZBBAKB-48 IT
Brand:Micron
S76HS512TC0BHB013
Brand:Infineon Technologies
MT29GZ5A5BPGGA-046IT.87J TR
Brand:Micron
MT29GZ6A6BPIET-046IT.112
Brand:Micron
MT29GZ6A6BPIET-046AAT.112 TR
Brand:Micron
Hong Kong: 852-26713361
Shen Zhen: 0755-21913499
Email:sales@sanxi-pro.com