Manufacturer No:08EP08-N3GTC32-GA67
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 8GB+8Gb 136 ball ePoP
RFQ
CLOSE
Product Attribute | Attribute Value |
---|---|
Manufacturer: | Kingston |
Product Category: | Multichip Packages |
RoHS: | Details |
Memory Size: | 8 GB 8 Gbit |
Package / Case: | FBGA-136 |
Mounting Style: | SMD/SMT |
Minimum Operating Temperature: | - 25 C |
Maximum Operating Temperature: | + 85 C |
Brand: | Kingston |
Interface Type: | eMMC 5.1 |
Moisture Sensitive: | Yes |
Packaging: | Tray |
Product Type: | Multichip Packages |
other: | 152 |
Subcategory: | Memory & Data Storage |
Unit Weight: | 0.005714 oz |
W25M512JWBIQ TR
Brand:Winbond
IS71LD32160WP128-25BPLI
Brand:ISSI
MT29VZZZCDA1SKPR-046 W.181 TR
Brand:Micron
MT29GZ6A6BPIET-53IT.112
Brand:Micron
MT30AZZZCDBZTPEQ-031 W.16D TR
Brand:Micron
W71NW11GC1DW
Brand:Winbond
MT29VZZZCD92XKSM-046 W.184 TR
Brand:Micron
MT29GZ6A6BPIET-046AIT.112
Brand:Micron
S71KS512SC0BHV000
Brand:Infineon Technologies
MT29GZ5A5BPGGA-53IT.87J TR
Brand:Micron
Hong Kong: 852-26713361
Shen Zhen: 0755-21913499
Email:sales@sanxi-pro.com