Manufacturer No:08EP08-N3GTC32-GA67
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 8GB+8Gb 136 ball ePoP
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Product Attribute | Attribute Value |
---|---|
Manufacturer: | Kingston |
Product Category: | Multichip Packages |
RoHS: | Details |
Memory Size: | 8 GB 8 Gbit |
Package / Case: | FBGA-136 |
Mounting Style: | SMD/SMT |
Minimum Operating Temperature: | - 25 C |
Maximum Operating Temperature: | + 85 C |
Brand: | Kingston |
Interface Type: | eMMC 5.1 |
Moisture Sensitive: | Yes |
Packaging: | Tray |
Product Type: | Multichip Packages |
other: | 152 |
Subcategory: | Memory & Data Storage |
Unit Weight: | 0.005714 oz |
MT30AZZZDDB0TPWL-031 W.19R TR
Brand:Micron
MT29GZ5A3BPGGA-53AIT.87K TR
Brand:Micron
MT29VZZZCDA1SKPR-046 W.181 TR
Brand:Micron
MT29GZ6A6BPIET-046AIT.112
Brand:Micron
W71NW11HC1DW
Brand:Winbond
08EP08-N3GTC32-GA67
Brand:Kingston
MT30AZZZCDA0TKQS-031 W.20V
Brand:Micron
MT29GZ6A6BPIET-53IT.112 TR
Brand:Micron
MT29C4G48MAYBBAMR-48 IT TR
Brand:Micron
W71NW10GF3FW
Brand:Winbond
Hong Kong: 852-26713361
Shen Zhen: 0755-21913499
Email:sales@sanxi-pro.com