Manufacturer No:08EP08-N3GTC32-GA67
Manufacturer:Kingston
Type:Multichip Packages
Description:Multichip Packages 8GB+8Gb 136 ball ePoP
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| Product Attribute | Attribute Value |
|---|---|
| Manufacturer: | Kingston |
| Product Category: | Multichip Packages |
| RoHS: | Details |
| Memory Size: | 8 GB 8 Gbit |
| Package / Case: | FBGA-136 |
| Mounting Style: | SMD/SMT |
| Minimum Operating Temperature: | - 25 C |
| Maximum Operating Temperature: | + 85 C |
| Brand: | Kingston |
| Interface Type: | eMMC 5.1 |
| Moisture Sensitive: | Yes |
| Packaging: | Tray |
| Product Type: | Multichip Packages |
| other: | 152 |
| Subcategory: | Memory & Data Storage |
| Unit Weight: | 0.005714 oz |
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W71NW11GF1EW
Brand:Winbond

08EP08-N3GTC32-GA67
Brand:Kingston
S71KS512SC0BHB003
Brand:Infineon Technologies
W25M512JWBIQ
Brand:Winbond
W25M02GWTBIT
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MT29GZ6A6BPIET-046IT.112
Brand:Micron

W71NW11GC1DW
Brand:Winbond
MT29VZZZCD9GUKPR-046 W.215 TR
Brand:Micron
Hong Kong: 852-26713361
Shen Zhen: 0755-21913499
Email:sales@sanxi-pro.com






